COS30018 Intelligent Systems

COS30018 Intelligent Systems

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COS30018 Intelligent Systems

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COS30018 Intelligent Systems

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Course Code: COS30018
University: Swinburne University Of Technology is not sponsored or endorsed by this college or university

Country: Australia


Apply this knowledge and explain about other similar applications where this system can be applied and its advantages.


Applications of Microtronic’s New Eagleview Macro Defect Inspection System and its technology
Apart from the minute inspection of wafer defects, this system can also be used for many other similar purposes as below,
Dicing inspection
Dicing is defined as the process in which the die is removed from the wafer. After this process the processing of the wafer is performed. The minute defect capturing capability helps to record and analyse each sector of the wafer. The wavelength of the light chosen is such that it is of the order of the band gap of the semiconductor material used. Graph is generated after multiple scanning at multiple depths. This ensures accuracy. Scribing and cutting by LASER is performed, after which the diced wafer is mounted on the carriers making them ready to be used in the electronic devices (ES Components, 2017).
Photomask inspection
In this process the photomasks are inspected closely and accurately because they have to be made completely ready for semiconductor fabrications. The deformities of the photomasks around the edges are noticed using powerful beam of light, incident on it. It is typically around 538 nm wavelength. The dark and bright incident as well as transmitted fields helps in observing the holes, impurities and deformations (Photo Sciences Incorporated, n.d.).
Die inspection
Dice inspection involves the correctness of the defects introduced on the dice during handling, dicing or any other external activity. High resolution images are mapped to find these abnormalities and correct them so that the efficiency and the yield is not affected. The electro-microscopic devices identifies the bumps accurately (Semiprobe, n.d.).
BGA inspection
BGA inspection involves the identification of solder defects which cannot be seen from the naked eyes properly. In SMD soldering techniques many times it is uncertain whether the joint is properly established or not. Once the Printed Circuit Board (PCB) is installed in the electronic devices, at the time of operation if the performance is decreased then it becomes tedious to start over again. So, in the first stage itself those defects can be observed and accordingly moved to the re-soldering department and the issue can be easily resolved. 3D imaging further improves the ease and it is less expensive than x-ray systems as well (Caltex Systems, n.d.).

High level of accuracy that cannot be achieved through manual inspection can be easily achieved.
Automation decreases the need for workers and hence cuts the costs.
Delivers consistent results without any compromise to the yield.
High performance.
Does not require any time consuming recipe and hence their maintenance.
It can find out the root cause of the defect through the huge data maintained after comparing and analysing with each other.
Easy to integrate with the pre-semiconductor inspecting machinery.

Caltex Systems (no date) BGA Inspection [Online]. Available from: [Accessed 4 October 2018].
ES Components (2017) Tell Me – What Is Wafer Dicing? [Online]. Available from: [Accessed 4 October 2018].
Photo Sciences Incorporated (no date) Photomask Inspection [Online]. Available from: [Accessed 4 October 2018].
SemiProbe (no date) Wafer & Die Inspectio. [Online]. Available from: [Accessed 4 October 2018].

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